SINGAPORE – Advanced packaging solution provider Capcon Singapore Pte. Ltd., has secured around US$50 million in series B2 funding to strengthen operations.

The company says that it will use the proceed to strengthen its capabilities in manufacturing, marketing and research and development.

Capcon offers a full range of advanced packaging processes, including die bonders for panel-level packaging, wafer-level packaging, flip chips, systems in the packaging (SIPs) and stack dice.

The company specializes in providing products and solutions for the intelligent manufacturing, semiconductors and pan-semiconductor fields.

It uses high-precision pick-and-place technology to launch mass transfer equipment and expanded to AOI tester and sorter with its testing and identifying capability.

In a statement, the company said it is preparing to release six series of products, namely Andromeda, Eridani, Leo, Monoceros, Reticulum and Venus.

Capcon currently supplies to nearly 30 customers, seven of which are in the top ten semiconductor companies worldwide.

The firm has received many re-purchases from ASE Group, Siliconware Precision Industries, NEPES and TongFu Microelectronics.

Capcon aims to maintain a three-fold revenue growth this year, as well as open a series B3 funding round, which will allow it to provide a ‘wider range of services’.

The company said its founding members have around 30 years of expertise in the semiconductor industry, as well as in developing software and hardware for packaging.

The new investment comes at a time when the semiconductor sector is growing at a Compound Annual Growth Rate (CAGR) of 10.6%, according to Singapore’s Minister for Trade and Industry Gan Kim Yong.

To support the growth in the sector, the government has continued to partner with key companies across the value chain, many of whom are global leaders in the sector, to invest in leading-edge manufacturing capacities and workforce training in Singapore.

According to Yong, recent investments by Globalfoundries, UMC, Siltronics, and Pall Corporation are testament to the strong partnership that the government has built with the industry leaders.

“We also work with partner manufacturers to conduct complementary activities in Singapore, including in R&D and supply chain management, to diversify their base of activities and deepen their operations here,” said Kim Yong.

“In addition, we are also working with them to address their longer-term challenges, including achieving their sustainability ambitions.”

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