Silicon Box to construct US$3.6B chip plant in Italy

ITALY – Silicon Box, a semiconductor packaging company headquartered in Singapore, has announced ambitious plans to invest up to US$3.6 billion in collaboration with the Italian government to establish a cutting-edge semiconductor assembly and test facility in Northern Italy.

The strategic investment aims to address the growing demand for advanced packaging capacity, crucial for the adoption of next-generation technology by 2028.

This multi-year initiative will facilitate Silicon Box’s expansion into 3D integration and testing, mirroring the success of its flagship foundry in Singapore.

Upon completion, the Italian facility is projected to create nearly 1,600 direct jobs, with thousands of additional roles expected in the form of indirect suppliers and contract construction positions.

Immediate commencement of design and planning activities is planned, with construction slated to begin post-approval from the European Commission regarding the proposed financial support from the Italian government.

Byung Joon Han, co-founder, and CEO of Silicon Box, underscores the alignment of values between the company and Italy, citing the country’s cultural embrace of curiosity, passion, and commitment to excellence.

“We believe innovation is driven by cultural values that embrace curiosity, passion, and a tireless commitment to excellence,” added Dr. Joon (BJ) Han.

 “Italy was one of our top choices for global expansion because we found that its culture shares our values.  We have seen great promise through our collaborations with the Italian government and various regional, institutional and commercial stakeholders to date, which we know will be necessary to successfully execute this first-of-a-kind project in Europe.”

The collaboration with Italian government and stakeholders underscores the significance of joint efforts in executing this pioneering project in Europe.

The integrated production facility in Italy is poised to catalyze broader ecosystem investments and innovation within Italy and the European Union, fostering advancements in various sectors including artificial intelligence, high-performance computing, automotive, wearables, and mobile technologies.

In adherence to Europe’s net-zero principles, the facility will be designed to minimize its carbon footprint and environmental impact, emphasizing Silicon Box’s commitment to sustainability.

This substantial investment follows Silicon Box’s earlier initiative in July, when the company launched a US$2 billion advanced semiconductor manufacturing facility in Tampines, Singapore, further solidifying its position as a key player in advanced manufacturing.

The Silicon Box foundry represents a significant advancement in semiconductor manufacturing, focusing on true chiplet-based production, enabling the construction of single chip packages through the integration of multiple modular units (chiplets).

Dr. Byung Joon Han emphasizes the company’s readiness to address the unique challenges associated with chiplet adoption, essential for driving emergent technologies forward.

For all the latest packaging and printing industry news from Africa and the World, subscribe to our NEWSLETTER, follow us on LinkedIn and subscribe to our YouTube channel.