Odisha breaks ground on India’s first 3D glass chip packaging unit with US$233M investment

INDIA – 3D Glass Solutions Inc. has broken ground on India’s first advanced 3D glass chip packaging unit in Bhubaneswar’s Info Valley, a ₹1,943 crore (approximately US$233 million) facility designed to produce 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules annually for defence, AI, automotive, and 5G/6G communications.

The groundbreaking ceremony on April 19, 2026, was attended by Odisha Chief Minister Mohan Charan Majhi and Union Electronics and IT Minister Ashwini Vaishnaw, who called it a “historic day” for the state.

The project is being implemented through 3DGS’s wholly owned Indian subsidiary, Heterogeneous Integration Packaging Solutions Pvt Ltd, with investors including Intel and Lockheed Martin.

Why Glass Packaging Matters for Semiconductors

Unlike traditional silicon substrates, glass offers superior radio frequency performance, lower electrical loss, and enhanced thermal stability for passive component integration.

The plant will deploy advanced 3D Heterogeneous Integration packaging technology, which stacks multiple chips and components together in a compact module to dramatically improve performance while shrinking size.

Until now, India has had no commercial-scale facility capable of this advanced packaging technology.

The vertically integrated unit will handle glass interposers with passives and silicon bridges, serving high-stakes applications including artificial intelligence, defence systems, data centres, high-performance computing, and co-packaged optics.

Commercial production is targeted to begin by August 2028, with full-scale output by August 2030.

Government Support and Job Creation

The Centre is providing ₹799 crore (approximately US$96 million) in fiscal assistance, with the Odisha state government adding approximately ₹399.5 crore (approximately US$48 million), together covering nearly 60 percent of the project cost. The facility is expected to generate over 2,500 direct and indirect jobs.

Union Minister Ashwini Vaishnaw noted that Odisha is now becoming an IT hub and electronics manufacturing hub, diversifying from its traditional metals and minerals base to high-tech industries.

Odisha is now uniquely positioned as the only state in India hosting both the country’s first compound semiconductor fabrication unit (being built by SiCSem) and the first 3D glass substrate packaging facility on the same industrial campus.

When Chip Packaging Becomes Strategic

Advanced packaging is no longer an afterthought in semiconductor manufacturing, it is where performance gains now come from.

 India has leapfrogged from importing packaged chips to building its own glass substrate facility with global investors. For the electronics packaging sector, Odisha just became a destination.

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