HP, ePac sign US$50M deal to expand digital flexible packaging capacity

USA – HP Inc. and ePac Flexible Packaging have signed a three-year commercial agreement valued at approximately US$50 million, reinforcing a decade-long strategic partnership in digital flexible packaging.

Under the deal, ePac will install more than 10 HP Indigo 200K digital presses across its facilities in North America and Europe. The agreement was formalized during a visit by ePac’s executive leadership team to Israel.

Once installations are completed, nearly one-third of ePac’s global press fleet will be based on the HP Indigo 200K platform.

The immediate value of the equipment purchase is estimated at US$20 million, with a further US$30 million projected over three years from consumables and technical services.

Built on HP Indigo’s fifth-generation digital platform, the 200K press delivers approximately 30% higher print speed and up to 45% greater overall throughput compared with previous-generation models.

The system also integrates AI-enabled tools for automated print quality diagnostics, real-time defect detection and correction, features aimed at reducing waste, improving uptime and enhancing consistency in high-volume flexible packaging production.

“This new agreement underscores the strength of our partnership and equips ePac with even greater capacity to respond faster, minimize waste, grow profitably and continue defining the future of digital flexible packaging,” said Oran Sokol, VP and global head of strategic sales at HP Industrial Print.

Parag Patel, president of shared services at ePac, described the investment as transformative.

“This US$50 million investment marks a pivotal moment in ePac’s evolution. By integrating more than 10 HP Indigo 200K digital presses into our global network, we are not just expanding capacity; we are redefining the standard for high-speed, sustainable packaging.”

The announcement follows ePac’s January 2026 update outlining significant expansion and technology upgrades across its European footprint.

Facilities in Lyon (France), Innsbruck (Austria), Silverstone (UK) and Poland are undergoing equipment installations and workforce expansion to meet rising demand for short-run, customized packaging.

Digital flexible packaging continues to gain traction as brands seek faster time-to-market, SKU proliferation and reduced inventory risk.

HP Indigo technology has been central to ePac’s distributed manufacturing model, which emphasizes localized production and reduced transportation emissions.

As converters scale digital capacity to compete with conventional flexo in both speed and economics, partnerships such as this highlight the increasing industrialization of digital print in mainstream flexible packaging production.

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