Dai Nippon Printing (DNP) switches to eco-friendly packaging for photo media

JAPAN – Dai Nippon Printing (DNP) is transitioning from plastic to paper for packaging its in-house-manufactured photo media, including ink ribbons and printing paper.

This significant shift from petroleum-based plastic to biomass plant-based renewable resource paper is not just a change in packaging but a commitment to our environment.

It is expected to reduce the company’s CO₂ emissions by a remarkable 69%, amounting to around 45 tons annually. This is a testament to our dedication to sustainability and a cause for all our stakeholders to feel proud and responsible.

DNP is not just changing materials, but also revolutionizing the packaging process. The company has introduced and originally designed an automated packaging machine for photo media production, a testament to our commitment to technological innovation.

This machine ensures the same quality and lead time as when using plastic materials, serving both industrial and commercial sectors. Our aim is to improve logistical efficiency with smaller cardboard boxes that facilitate easier unpackaging and save storage space.

This initiative is not just a change in packaging but a pioneering move in the dye-sublimation thermal transfer photo media industry.

DNP has been considering this material change and the adoption of automated packaging since 2022 and has now established a framework for the transition.

The switch will begin with photo media produced in Japan in May 2024 and be phased out to overseas production bases, setting a new standard in our industry.

DNP corporate officer Kazuo Murakami expressed his hope, “We believe that this new initiative will not only benefit our environment but also inspire everyone who uses photo media to make sustainable choices. Your engagement in this journey is invaluable to us, and we look forward to your continued support.”

Advancements in semiconductor manufacturing

In other news, DNP has initiated full-scale development of photomask manufacturing for 2-nanometer (10^-9 meter) generation logic semiconductors supporting Extreme Ultra-Violet (EUV) lithography, a cutting-edge process in semiconductor manufacturing.

The company will also act as a subcontractor, providing this new technology to Tokyo-based Rapidus Corporation, which is part of the Research and Development Project of the Enhanced Infrastructures for Post 5G Information and Communication Systems led by the New Energy and Industrial Technology Development Organization (NEDO).

Recent advances have been made in producing cutting-edge logic semiconductors using EUV. In 2016, DNP became the world’s first merchant photomask manufacturer to introduce the multi-beam mask writing tool (MBMW).

In 2023, DNP completed developing a photomask manufacturing process for 3-nm generation EUV lithography and began developing 2-nm generation technology.

To address the need for further miniaturization, DNP will embark on full-scale development of a photomask manufacturing process for 2-nm generation EUV lithography, including operating second and third multi-electron beam mask lithography systems in FY 2024.

DNP plans to bring its second and third MBMW mask lithography systems online in FY 2024, accelerating the development of photomasks for 2-nm generation EUV lithography.

Acting as a subcontractor for the Development of Advanced Semiconductor Manufacturing Technology commissioned by Rapidus, DNP aims to complete the development of a manufacturing process for 2-nm generation photomasks by FY 2025.

From FY 2026 onwards, DNP will work on establishing production technology to commence mass production by FY 2027.

Additionally, DNP is looking beyond the 2-nm generation, signing an agreement with imec, a leading international research organization in Leuven, Belgium, to develop next-generation EUV photomasks jointly.

DNP will continue to contribute to the growth of Japan’s semiconductor industry by fostering development in collaboration with various international partners.

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